Top 10 G Skill Gaming Laptop Ram Dr4

Vengeance LPX memory is designed for high-performance overclocking. The heat spreader is made of pure aluminum for faster heat dissipation, and the eight-layer PCB helps manage heat and provides superior overclocking headroom. Each IC is individually screened for performance potential. The DDR4 form factor is optimized for the latest Intel 100 Series motherboards and offers higher frequencies, greater bandwidth, and lower power consumption than DDR3 modules. Vengeance LPX DDR4 modules are compatibility-tested across 100 Series motherboards for reliably fast performance. There’s XMP 2.0 support for trouble-free automatic overclocking. And, they’re available in multiple colors to match your motherboard, your components, or just your style.

32GB G.Skill DDR4 kit, Trident Z Neo designed specifically for the latest AMD Ryzen 3000, X570 Series. 3600MHz, PC4-28800, CL18 (18-22-22-42) at 1.35V. With Trident Z Neo RGB heatsinks, 2x 16GB modules.

CORSAIR high performance Vengeance SODIMM memory kit 2666MHz CL18 1 2V allows you to automatically boost performance of your without BIOS reconfiguration Slim and attractive design to ensure physical compatibility with all 6th Generation Intel Core i5 and i7 notebooks Each module is built using carefully selected DRAM to allow excellent stability and is backed by Corsair’s limited lifetime Customer Service / Tech support 1-888-222-4346 opt 1

Features: Extreme performance DDR4 memory designed for gaming and PC enthusiasts Optimized compatibility with DDR4-compatible Intel Core platforms Sleek and stylish aluminum heat spreader design 1.35V ultra low voltage Intel XMP 2.0 support Series Ripjaws V, Memory Type DDR4, Capacity 16GB (8GBx2) , Multi-Channel Kit Dual Channel Kit, Tested Speed 3200MHz, Tested Latency 16-18-18-38-2N, Tested Voltage 1.35v, Registered/Unbuffered Unbuffered, Error Checking Non-ECC SPD Speed 2133MHz, SPD Voltage 1.20v, Fan lncluded No, height 42 mm / 1.65 inch, Warranty Limited Lifetime Features: Intel XMP 2.0 (Extreme Memory Profile) Ready

16GB G.Skill DDR4 kit, Trident Z Neo designed specifically for the latest AMD Ryzen 3000, X570 Series. 3600MHz, PC4-28800, CL18 (18-22-22-42) at 1.35V. With Trident Z Neo RGB heatsinks, 2x 8GB modules.

32GB G.Skill DDR4 kit, Trident Z Neo designed specifically for the latest AMD Ryzen 3000, X570 Series. 3600MHz, PC4-28800, CL16 (16-19-19-39) at 1.35V. With Trident Z Neo RGB heatsinks, 2x 16GB modules.

HyperX FURY DDR4 features an updated heat spreader and speeds up to 3466MHz for a stylish performance boost. FURY DDR4’s XMP-ready and available in 2400MHz–3466MHz speeds, CL15–16 latencies, 8GB and 16GB single module capacities, and 16GB–64GB kit capacities. It features Plug N Play automatic overclocking at 2400MHz and 2666MHz speeds and is compatible with the latest Intel and AMD CPUs. FURY DDR4 RGB’s backed by a lifetime, a worry-free, cost-effective upgrade. HyperX PnP memory will run in most DDR4 systems up to the speed allowed by the manufacturer’s system BIOS. PnP cannot increase the system memory speed faster than is allowed by the manufacturer’s BIOS. AMD Ryzen systems will boot at the JEDEC default speed/latency with FURY. In order to enable the factory overclock speed and latency, Profile 1 must be selected in the BIOS.

DDR4 3200Mhz for Ryzen.

Dual channel 16GB DDR4 memory upgrade, made up of 2x 8GB modules. The G.Skill Aegis DDR4 Series is designed for entry-level computer gamers, looking for great performance at a great price. 288 pins, 3000MHz memory module, PC4-24000 standard and timings of CL16 (16-18-18-38). Operating at 1.35V, this memory generates less heat than standard DDR4 modules.

CT16G4SFD824A is a 16GB DDR4 Notebook module that operates at speeds up to 2400 MT/s and has a CL17 latency. It is an Buffered SODIMM. It conforms to the industry standard DDR4 SODIMM layout of 260 pins and is compatible with systems that take DDR4 2400MT/s SODIMM memory.